Microelectronics Packaging and Integration
نویسندگان
چکیده
منابع مشابه
European Microelectronics and Packaging Symposium
An advanced substrate level patterning technique is presented to realize 3D interconnection circuitry on electronic modules. The technique is based on diffraction of light by phase gratings. The phase gratings are incorporated into the photomask at discrete locations. By illuminating the photomask at normal incidence, the phase grating causes locally inclined UV exposure, which is used to expos...
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ژورنال
عنوان ژورنال: MRS Bulletin
سال: 2003
ISSN: 0883-7694,1938-1425
DOI: 10.1557/mrs2003.13